Cooling device and method for manufacturing same

ABSTRACT

This cooling device has: an evaporation section for storing a refrigerant; a condensation section for radiating the heat of a gas-phase refrigerant, which has been gasified by the evaporation section, by condensing and liquefying the gas-phase refrigerant; a vapor pipe for transporting the gas-phase refrigerant to the condensation section; a liquid pipe for transporting a liquid-phase refrigerant, which has been condensed by the condensation section, to the evaporation section; and a mounting plate provided with a connection structure connected to the device side which is to be cooled. The evaporation section is disposed on one surface of the mounting plate, and the condensation section is disposed on the other side of the mounting plate. This method for manufacturing a cooling device is configured in such a manner that a mounting plate is formed by providing a connection structure to a flat surface member, an evaporation section is disposed on one surface of the mounting plate, a condensation section is disposed on the other side of the mounting plate, and the condensation section is connected to the evaporation section by piping. In cooling devices using a phase change cooling method, the cost of manufacturing the entirety of each of the devices increases because the interchangeability of the device with existing cooling devices needs to be ensured.

TECHNICAL FIELD

The invention relates to a cooling device which is used for a semiconductor device, an electronic device, or the like, and a manufacturing method thereof, and relates to, for example, a cooling device using a phase change cooling system in which heat transportation and heat radiation are carried out in a phase change cycle of evaporation of a refrigerant and condensation thereof, and a manufacturing method thereof.

BACKGROUND ART

In recent years, high-performance and high-functioning of a semiconductor device, an electronic device, or the like are actualized and accordingly a calorific value thereof is increased. A cooling device having large heat transportation capacity and high-performance is required.

As a cooling device with high-performance, a phase change cooling device which uses phase change of a refrigerant for heat transportation has been developed. The phase change cooling device typically includes an evaporation section which receives heat from a heat generating body and changes a liquid-phase refrigerant into gas-phase, and a condensation section which removes heat from a gas-phase refrigerant to change in phase from gas-phase to liquid-phase using an external fan, etc.

As described above, the cooling device using a phase change cooling system in which heat transportation and heat radiation are carried out in a phase change cycle of evaporation of a refrigerant and condensation thereof can improve heat transportation capacity compared with a heat sink, or the like.

An example of the cooling device using the phase change cooling system is described in Patent Literature 1.

FIG. 7 illustrates a cross sectional view of a related cooling device described in Patent Literature 1. A phase change cooling device 700 is used in order to cool a semiconductor device, like a CPU (Central Processing Unit) mounted on a circuit substrate.

The related cooling device 700 includes an evaporation section 702 which is mounted on a surface of a semiconductor device which is a heat generating body 708, and a condensation section 701 having a radiating surface (radiator). A pair of pipes consisting of a vapor pipe 703 and a liquid pipe 704 is mounted between the evaporation section 702 and the condensation section 701.

Heat generated in the heat generating body 708 is transported to the evaporation section 702. In the evaporation section 702, a liquid-phase refrigerant is evaporated by the transported heat. A gas-phase refrigerant which is changed in phase from the liquid-phase refrigerant is led from the evaporation section 702 to the condensation section 701 through the vapor pipe 703.

In the condensation section 701, the gas-phase refrigerant is cooled by a cooling fan 709 to return to the liquid-phase refrigerant. The liquid-phase refrigerant flows back to the evaporation section 702 through the liquid pipe 704.

Patent Literature 2 describes another structure of the cooling device using the phase change cooling system. FIG. 8 illustrates a cross sectional view illustrating another structure of the related cooling device.

A phase change cooling device 800 includes an evaporation section 802 and a condensation section 801. A pair of pipes consisting of a vapor pipe 803 and a liquid pipe 804 is arranged between the evaporation section 802 and the condensation section 801.

The structure of the phase change cooling device 800 differs from the structure of the phase change cooling device 700 in that the condensation section 801 is arranged nearly in parallel to a heat generating body 808, and the evaporation section 802 and the condensation section 801, etc. are gathered and arranged just above the heat generating body 808.

A reference technology is disclosed in Patent Literature 3.

CITATION LIST Patent Literature

[PTL 1] Japanese Patent Application Laid-Open No. 2011-047616

[PTL 2] Japanese Patent Application Laid-Open No. Hei 10-335551

[PTL 3] Japanese Patent Application Laid-Open No. Hei 09-186279

SUMMARY OF INVENTION Technical Problem

The related cooling devices described in Patent Literatures 1 and 2 include a following problem.

The cooling device described in Patent Literature 1 includes the evaporation section 702 and the condensation section which are separately arranged. The cooling device described in Patent Literature 1 cannot be applied to an electronic device having a structure in which the electronic device is cooled by a heat sink arranged just above a heat generating body, without changing layout of an existing device. Review of a footprint in an electronic device and review of a flow of air which is sent by a cooling fan (hereinafter referred to as “airflow”) are required. As describe above, the problem exists, in which interchangeability with an existing cooling device is lacked.

In the cooling device described in Patent Literature 2, though the evaporation section 802 and the condensation section 801, etc. are gathered and arranged just above the heat generating body, the condensation section 801 is arranged nearly in parallel to the heat generating body 808. The airflow generated by the cooling fan 809 is, therefore, nearly vertical to the heat generating body 808 and the whole airflow inside the electronic device widely changes. The problem exists, in which the whole airflow inside the electronic device has to be reviewed and the interchangeability with an existing cooling device is lacked.

As described above, the cooling devices disclosed in Patent Literatures 1 and 2 lacks the interchangeability with an existing cooling device, and cannot use asset of a cooling structure. Therefore a device layout for phase change cooling has to be designed again. Consequently cost for development and manufacturing is increased.

The related cooling device which employs a phase change cooling system requires redesign since the interchangeability with an existing cooling device is lacked, and manufacturing cost of an entire device including a cooling target or a cooling device is increased.

An object of the invention is to provide a cooling device and a method for manufacturing the device which solve the problem in which the manufacturing cost of the entire devices increases since the interchangeability with existing cooling devices needs to be ensured.

Solution to Problem

The cooling device of the invention includes an evaporation section for storing a refrigerant, a condensation section for radiating heat by condensing and liquefying a gas-phase refrigerant that is gasified in the evaporation section, a vapor pipe for transporting the gas-phase refrigerant to the condensation section, a liquid pipe for transporting a liquid-phase refrigerant that is condensed in the condensation section to the evaporation section, and a mounting plate provided with a connection structure connected to the side of a device that is a cooling target. The evaporation section is disposed on one surface of the mounting plate and the condensation section is disposed on the other side of the mounting plate.

In the method for manufacturing the cooling device of the invention, a mounting plate provided with a connection structure connected to the side of a device that is a cooling target is formed by providing the connection structure to a flat surface member, an evaporation section for storing a refrigerant is disposed on one surface of the mounting plate, a condensation section for radiating heat by condensing and liquefying a gas-phase refrigerant that is gasified in the evaporation section is disposed on the other side of the mounting plate, and the condensation section is connected to the evaporation section by piping.

Advantageous Effects of Invention

According to the cooling device and the method for mounting the same, it is possible to ensure the interchangeability with existing cooling devices and avoid increase of manufacturing cost of an entire device.

BRIEF DESCRIPTION OF DRAWINGS

[FIG. 1A] a front view illustrating a structure of a cooling device of a first exemplary embodiment of the invention,

[FIG. 1B] a top view illustrating a structure of a cooling device of a first exemplary embodiment of the invention,

[FIG. 2] a perspective view explaining details of a structure of an evaporation section of a second exemplary embodiment of the invention,

[FIG. 3A] a cross sectional view explaining details of a structure of an evaporation section of a third exemplary embodiment of the invention,

[FIG. 3B] a cross sectional view explaining details of the structure of the evaporation section of the third exemplary embodiment of the invention,

[FIG. 3C] a cross sectional view explaining details of the structure of the evaporation section of the third exemplary embodiment of the invention,

[FIG. 4A] a front view illustrating a structure of a cooling device of a fourth exemplary embodiment of the invention,

[FIG. 4B] a top view illustrating the structure of the cooling device of the fourth exemplary embodiment of the invention,

[FIG. 5A] a front face explaining a structure of each layer of mounting plates of a fifth exemplary embodiment of the invention,

[FIG. 5B] a backside explaining the structure of each layer of mounting plates of the fifth exemplary embodiment of the invention,

[FIG. 6A] a front face explaining a structure of each layer of mounting plates of a sixth exemplary embodiment of the invention,

[FIG. 6B] a backside explaining the structure of each layer of mounting plates of the sixth exemplary embodiment of the invention,

[FIG. 7] a cross sectional view illustrating a structure of a related cooling device,

[FIG. 8] a cross sectional view illustrating another structure of a related cooling device.

DESCRIPTION OF EMBODIMENTS First Exemplary Embodiment

An exemplary embodiment of the invention is explained by referring to drawings. In following explanations, parts having the same function have the same reference sign, and explanations thereof may be omitted.

Structure

FIG. 1A is a front view illustrating a structure of a phase change cooling device 100 of a first exemplary embodiment of the invention. FIG. 1B is a top view illustrating the structure of the phase change cooling device 100 of the first exemplary embodiment of the invention,

As illustrated in FIG. 1A and FIG. 1B, the phase change cooling device 100 includes a condensation section 101, an evaporation section 102, a vapor pipe 103, a liquid pipe 104, a mounting plate 105 and a condensation section mounting metal fittings 107.

The condensation section 101 is fixed on a top face of the mounting plate 105 by the condensation section mounting metal fittings 107.

The evaporation section 102 is placed under the mounting plate 105 and is pressed against a heat generating body 108 by the mounting plate 105.

The vapor pipe 103 connects a vapor header 101 a above the condensation section to the evaporation section 102.

The liquid pipe 104 connects a liquid header 101 b under the condensation section to the evaporation section 102.

It is preferable that the vapor pipe 103 and the liquid pipe 104 connect the condensation section 101 to the evaporation section 102 through the shortest path. For example, the vapor pipe 103 is configured to be vertically extended downward from an elbow 101 c which is projected from the vapor header 101 a of the condensation section and is connected thereto, and to be connected to an opening formed in a top face of the mounting plate 105 and the evaporation section 102. Consequently the condensation section 101 is connected to the evaporation section 102 through the shortest path.

One end of the liquid pipe 104 is connected to the evaporation section 102 and the other end thereof is connected to an opening which is formed in a bottom face of the liquid header 101 b of the condensation section and the mounting plate 105. Consequently the condensation section 101 is connected to the evaporation section 102 through the shortest path.

The condensation section 101 is configured to be disposed on the mounting plate 105. The mounting plate 105 includes a cooling device fixing tapped hole 115. The cooling device fixing tapped hole 115 is configured so that an existing cooling device satisfies interchangeability with a screw section of a mounted cooling target device to which an existing cooling device is mounted.

Operation

In the structure described above, the phase change cooling device 100 can be fixed on the heat generating body 108 at an existing tapped hole position in a footprint of an existing heat sink. The mounting plate 105 can ensure connection of the evaporation section 102 and the heat generating body 108.

Since the evaporation section 102 is disposed under the mounting plate 105, the evaporation section 102 is not disposed on the mounting plate 105 and flexibility of arranging the condensation section 101 on the mounting plate 105 is improved.

A width of a heat radiating face in the condensation section 101 is not restricted in the cooling device fixing tapped hole 115 and in arrangement of the evaporation section 102, and can be extended to the width of the mounting plate 105.

A depth of the heat radiating face in the condensation section 101 can be also extended within a range which is allowed by positions of the evaporation section 103 and the cooling device fixing tapped hole 115.

Effect

As described above, according to the phase change cooling device 100 of the exemplary embodiment, the connection structure of the mounting plate 105 can be fitted to that of a cooling target device. Consequently interchangeability can be ensured and increase of manufacturing cost for an entire device can be suppressed.

Further since the evaporation section 102 is disposed under the mounting plate 105, flexibility of arranging the condensation section 101 above the mounting plate 105 can be improved. As a result, since the heat radiating face in the condensation section 101 can be extended in the width direction and the depth direction, and a heat radiating area is enlarged and cooling efficiency is improved. The phase change cooling device 100 of the exemplary embodiment can cope with a heat generating body generating a large amount of heat.

Second Exemplary Embodiment

In this exemplary embodiment, a structure or a member which promotes evaporation of a refrigerant is disposed on a bottom face of the evaporation section 102 accumulating a refrigerant. Thereby cooling efficiency can be improved.

FIG. 2 is a perspective view illustrating details of a structure of the evaporation section 102 of the second exemplary embodiment of the invention. FIG. 2 illustrates an example in which an auxiliary member for evaporation 106 is disposed on the bottom face of the evaporation section 102.

The structure of this exemplary embodiment differs from that of the first exemplary embodiment in that the auxiliary member for evaporation 106 is disposed on the bottom face of the evaporation section 102. The other structure of this exemplary embodiment structure are the same as that of the first exemplary embodiment.

The auxiliary member for evaporation 106 is, for example, a porous member or a pleat-shaped (fin-shaped) member, and is a member or structure which enlarges a surface area. Since a contact area with the refrigerant is enlarged as the surface area is enlarged, evaporation of the refrigerant is promoted. When the auxiliary member for evaporation 106 is disposed, it is possible to improve evaporation efficiency of the refrigerant in the evaporation section 102. It is possible to make the evaporation section 102 compact (e.g. lowered) while keeping evaporation efficiency of the refrigerant.

When the evaporation section is made lowered, the height of the condensation section can be heightened correspondingly while maintaining the constant mounting height. As a result, the heat radiating area in the condensation section can be enlarged and cooling efficiency can be further improved.

Third Exemplary Embodiment

FIG. 3A, FIG. 3B and FIG. 3C are plan cross sectional views illustrating details of a structure of an evaporation section of a third exemplary embodiment of the invention. FIG. 3A, FIG. 3B and FIG. 3C shows examples of modification of a cross section shape of the auxiliary member for evaporation 106 and examples of change of a degree that the auxiliary member for evaporation 106 occupies the inside of the evaporation section 102.

The auxiliary member for evaporation 106 employs, for example, a sintered body including a metal. If a cross section of a sintered body 106 a has a rectangular shape as shown in FIG. 3A when the sintered body is cut out from a base member producing the sintered body, the sintered body is cut out from the base body without any waste.

On the one hand, if a round space is formed in the evaporation section, a space is generated between the rectangle-shaped sintered body and the round space. The sintered body cannot be therefore disposed inside the evaporation section to the fullest extent.

If a cross section of a sintered body 106 b is circular as shown in FIG. 3B, the sintered body can be disposed in the evaporation section to the fullest extent even though the evaporation section includes a round space thereinside. On the other hand, when the round sintered body is cut out from the base member producing the sintered body, leftovers of the base member are generated. Therefore the base member is wasted.

If a cross section of a sintered body 106 c is hexagonal as shown in FIG. 3C, the sintered body can be efficiently disposed in the evaporation section even though the evaporation section includes a round space thereinside. When the base member of the sintered body is cut out, the hexagon-shaped sintered body does not generate waste of the base member. Therefore the base member is not wasted.

Above descriptions are examples, and the present invention is not limited to the shape of the inside of the evaporation section and the shape of the sintered body which are described above.

Fourth Exemplary Embodiment

FIG. 4A is a front view illustrating a structure of a phase change cooling device 200 of a fourth exemplary embodiment of the invention. FIG. 4B is a top view illustrating the structure of the phase change cooling device 200 of the fourth exemplary embodiment of the invention.

The structure of this exemplary embodiment is differs from the first exemplary embodiment in that an evaporation section 202 and a liquid pipe 204 are disposed in a space which is formed in three mounting plates (top plate 305 a, middle plate 305 b and bottom plate 305 c).

In other words, the evaporation section 202 and the liquid pipe 204 are embedded in a space which is formed in three mounting plates (top plate 305 a, middle plate 305 b, and bottom plate 305 c). The other structure of this exemplary embodiment is the same as that of the first exemplary embodiment.

Structures and operations of a condensation section 201, a vapor pipe 203, a condensation section mounting metal fittings 207, and the like, in the phase change cooling device 200 are similar to those of the first exemplary embodiment, and the phase change cooling device 200 is pressed against a heat generating body 208 by a mounting plate (top plate 305 a, middle plate 305 b and bottom plate 305 c).

This exemplary embodiment has the same effect as that of the first exemplary embodiment. Since the evaporation section 202, etc. are embedded in the mounting plate (top plate 305 a, middle plate 305 b and bottom plate 305 c), the evaporation section and the vapor pipe are removed from components of the phase change cooling device. Since the number of components in the entire phase change cooling device is decreased, cost superiority can be expected. The evaporation section may include a fin 206 d. If the fin 206 d is mounted, evaporation is promoted and cooling efficiency is further improved.

The evaporation section 202 and the liquid pipe 204 which are embedded in a mounting plate 205 may have various structures. One example thereof is shown in FIG. 5.

FIG. 5A is the front face explaining a structure of each layer of the top plate 305 a, the middle plate 305 b and the bottom plate 305 c in the mounting plate of a fifth exemplary embodiment of the invention. FIG. 5B is the backside explaining a structure of each layer of the top plate 305 a, the middle plate 305 b and the bottom plate 305 c in the mounting plate of the fifth exemplary embodiment of the invention.

FIG. 5A illustrates the front face of the mounting plate (top plate 305 a, middle plate 305 b and bottom plate 305 c) in which members corresponding to the evaporation section 202 and the liquid pipe 204 of FIG. 4A and FIG. 4B are embedded. FIG. 5B illustrates the backside of the mounting plate (top plate 305 a, middle plate 305 b and bottom plate 305 c) in which members corresponding to the evaporation section 202 and the liquid pipe 204 are embedded.

A space which is enclosed by the front face of the bottom plate 305 c (left figure in FIG. 5A), an inner wall of an vapor device hole 335 b of the middle plate 305 b (FIG. 5A, FIG. 5B) and the backside of the top plate 305 a (FIG. 5B) corresponds to the evaporation section 202 in FIG. 4A and FIG. 4B.

A member combining a liquid pipe hole 325 a and a liquid pipe hole 325 b correspond to the liquid pipe 204 in FIG. 4A and FIG. 4B.

The function corresponding to the evaporation section 202 and the liquid pipe 204 of this exemplary embodiment is integrated in a laminated body including the top plate 305 a, the middle plate 305 b and the bottom plate 305 c.

As shown in FIG. 5A and FIG. 5B, an vapor pipe connection section 335 a and the liquid pipe hole 325 a are formed in the top plate 305 a. The backside of the top plate 305 a works as a front face of the evaporation section 202 (refer to FIG. 4A, FIG. 4B). The vapor device hole 335 b and the liquid pipe hole 325 b are formed in the middle plate 305 c. In the backside of the middle plate 305 b, the liquid pipe hole 325 b is formed in the direction which is nearly vertical to the face of the middle plate 305 b so as to form an opening, and a groove is formed in the direction which is in nearly parallel to the face of the middle plate 305 b. Thereby, like the liquid pipe 204 in FIG. 4 (liquid pipe 102 in FIG. 2 is also the same), the liquid pipe hole 325 b is formed into an L-shape.

The inner wall of the vapor device hole 335 b of the middle plate 305 b works as a side face of the evaporation section 202 (refer to FIG. 4A and FIG. 4B). In the bottom plate 305 c, a fin 306 d may be disposed on the face which comes in contact with a refrigerant. If the fin 306 d is disposed thereon, evaporation can be promoted. The front face of the bottom plate 305 c works as a bottom face of the evaporation section 202.

As described above, the evaporation section 302 is formed by the space which is enclosed by the front face of the bottom plate 305 c, the inner wall of the vapor device hole 335 b of the middle plate 305 b and the backside of the top plate 305 a. The liquid pipe 204 is formed by the space which is enclosed by the liquid pipe hole 325 a of the middle 305 b, the liquid pipe hole 325 b of the middle 305 b and the front face of the bottom plate 305 c.

The structures of the exemplary embodiment shown in FIG. 5A and FIG. 5B except the structure related to the top plate 305 a, the middle plate 305 b and the bottom plate 305 c are the same as the structure of the exemplary embodiment shown in FIG. 4A and FIG. 4B. The exemplary embodiment shown in FIG. 5A and FIG. 5B has the same effect as that of the first exemplary embodiment, like the exemplary embodiment shown in FIG. 4A and FIG. 4B.

Further, since the evaporation section and the liquid pipe can be formed by combining plate members, like the bottom plate, the middle plate, and the top plate, it is possible to make efficient use of design asset and to reduce processing cost. Consequently manufacturing cost can be further reduced. Combination of plate members is not limited to that of three plates. Various applications except above examples are possible.

Fifth Exemplary Embodiment

FIG. 6A is the front face explaining a structure of each layer of mounting plates of a fifth exemplary embodiment of the invention. FIG. 6B is the backside explaining the structure of each layer of mounting plates of the fifth exemplary embodiment of the invention.

In this exemplary embodiment, the evaporation section and the liquid pipe is formed by combining plate members, like the bottom plate, the middle plate, and the top plate, like the fourth exemplary embodiment. This exemplary embodiment differs from the fourth exemplary embodiment in that the bottom plate forming the bottom face of the evaporation section is made of the same metal material as that of the sintered body. The bottom plate forming the bottom face of the evaporation section 402 is a sintered body forming bottom plate 405 d which is made of the same metal material as that of the sintered body 406.

As described above, if the sintered body 406 is disposed in the inner bottom face of the evaporation section, evaporation of a refrigerant is promoted. A metal material which can form a sintered body is limited and may be different from the metal material forming the bottom face of the evaporation section. Consequently it may be difficult to connect different metals to each other while securing high thermal conductivity therebetween.

According to the structure of this exemplary embodiment, it is possible to make firm connection between both members while securing high thermal conductivity between the inner bottom face of the evaporation section and the sintered body. As a result, evaporation of a refrigerant in the evaporation section can be promoted and cooling efficiency is further improved.

The bottom plate 405 d is fixed to the middle plate using a screw, etc. through a screw hole 455 d of the bottom plate and a screw hole 355 b of the middle plate. In this fixing, a ring-shaped groove 465 d mat be formed on the bottom plate 405 d and an O-ring may be disposed on the groove. The structure with the O-ring improves adhesion between the bottom plate and the middle plate and further improves sealing performance for a refrigerant in the evaporation section.

The invention is explained by describing the exemplary embodiments. The exemplary embodiments are examples thereof. Various changes, increases, decreases, and combinations may be added to the above mentioned exemplary embodiments within the scope of the invention. A person ordinarily skilled in the art understands that modifications in which various changes, increases, decreases, and combinations are added thereto lies within the scope of the invention of the present application.

All or part of the above first and second exemplary embodiments can be described as follows, but not limited to the following.

Supplementary Note 1

A cooling device, including

an evaporation section for storing a refrigerant,

a condensation section for radiating heat by condensing and liquefying a gas-phase refrigerant that is gasified in the evaporation section,

a vapor pipe for transporting the gas-phase refrigerant to the condensation section;

a liquid pipe for transporting a liquid-phase refrigerant that is condensed in the condensation section to the evaporation section, and

a mounting plate provided with a connection structure connected to the side of a device that is a cooling target, wherein the evaporation section is disposed on one face of the mounting plate and the condensation section is disposed on the other side of the mounting plate.

Supplementary Note 2

The cooling device of the supplementary note 1, wherein at least a part of the evaporation section and the liquid pipe is disposed in a space that is formed at a part in the mounting plate in the plate thickness direction.

Supplementary Note 3

The cooling device of the supplementary note 1 or the supplementary note 2, wherein the condensation section includes an opening in a bottom face thereof, the mounting plate includes a first opening in an top face thereof, and the liquid pipe is formed so that the opening in the bottom face of the condensation section comes in contact with the first opening in the top face of the mounting plate.

Supplementary Note 4

The cooling device of any one of the supplementary note 1 to the supplementary note 3, wherein the mounting plate further includes a second opening in a top face thereof, and a connection section of the vapor pipe is formed in the second opening of the top face of the mounting plate.

Supplementary Note 5

The cooling device of any one of the supplementary note 1 to the supplementary note 4, wherein the mounting plate is formed so that a plurality of flat plate members are laminated.

Supplementary Note 6

The cooling device of the supplementary note 5, wherein the mounting plate including,

an top plate for forming an upper face of the evaporation section, the connection section of the vapor pipe, and a connection section of the liquid pipe,

a middle plate for forming a side face of the evaporation section and the liquid pipe, and

a bottom plate for forming a bottom face of the evaporation section.

Supplementary Note 7

The cooling device of any one of the supplementary note 1 to the supplementary note 6, wherein a size of the mounting plate is nearly equal to or larger than that of a heat radiating body which is cooling target.

Supplementary Note 8

The cooling device of any one of the supplementary note 1 to the supplementary note 7, wherein a fin-shaped projection is formed on the bottom face of the evaporation section that is contact with the liquid refrigerant.

Supplementary Note 9

The cooling device of any one of the supplementary note 1 to the supplementary note 7, wherein a sintered body is joined to the bottom of the evaporation section that comes in contact with the liquid refrigerant.

Supplementary Note 10

The cooling device of the supplementary note 9, wherein the sintered body includes a porous shape and the sintered body is connected to the bottom face of the evaporation section so that the porous shape is nearly maintained.

Supplementary Note 11

The cooling device of the supplementary note 9 or the supplementary note 10, wherein the sintered body is made of a metal which is the same as that of the bottom plate.

Supplementary Note 12

The cooling device of any one of the supplementary note 6 to the supplementary note 11, wherein the bottom plate is made of a metal that is different from that of either one or both of the middle plate and the top plate.

Supplementary Note 13

A method for manufacturing a cooling device, including,

forming a mounting plate provided with a connection structure connected to the side of a device that is a cooling target by providing a connection structure to a flat surface member,

disposing an evaporation section for storing a refrigerant on one surface of the mounting plate,

disposing a condensation section for radiating heat by condensing and liquefying a gas-phase refrigerant that is gasified in the evaporation section on the other side of the mounting plate, and

connecting the condensation section to the evaporation section by piping.

Supplementary Note 14

A method for manufacturing a cooling device of the supplementary note 13, further including,

forming a first flat surface member with an opening at a part thereof, and

laminating a second flat surface member and a third flat surface member on an upper face and a lower face of the first flat surface member to form the mounting plate and the evaporation section.

This application claims priority from Japanese Patent Application No. 2013-112908 filed on May 29, 2013, and the contents of which are incorporation herein by reference in their entirety.

INDUSTRIAL APPLICABILITY

The invention is applicable to, for example, a cooling device using the phase change cooling system which performs heat transportation and heat radiation on the basis of a phase change cycle of evaporation and condensation of a refrigerant.

REFERENCE SIGNS LIST

-   100, 200, 700, 800 phase change cooling device -   101, 201, 701, 801 condensation section -   101 a, 201 a vapor header -   101 b, 201 b liquid header -   101 c, 201 c elbow -   101 d, 201 d cooling pipe (tube) -   102, 202, 302, 402, 702, 802 evaporation section -   103, 203, 703, 803 vapor pipe -   104, 204, 304, 704,804 liquid pipe -   105, 205 mounting plate -   115, 215, 315 a, 315 b, 315 c cooling device fixing screw hole -   305 a top plate -   325 a liquid pipe hole -   335 a vapor pipe connection hole -   305 b middle plate -   325 b liquid pipe hole -   335 b evaporation device hole -   345 b liquid pipe notch -   355 b bottom plate fixing screw hole -   305 c bottom plate -   405 d sintered body forming bottom plate -   455 d bottom plate fixing screw hole -   465 d O-ring fixing groove -   106 evaporation auxiliary member -   106 a, 106 b, 106 c, 406 sintered body -   206 d 306 d fin -   107, 207 condensation section metal fittings -   108, 208, 708, 808 heat generating body -   709, 809 cooling fan 

What is claimed is:
 1. A cooling device, comprising: an evaporation section for storing a refrigerant; a condensation section for radiating heat by condensing and liquefying a gas-phase refrigerant that is gasified in the evaporation section; a vapor pipe for transporting the gas-phase refrigerant to the condensation section; a liquid pipe for transporting a liquid-phase refrigerant that is condensed in the condensation section to the evaporation section; and a mounting plate provided with a connection structure connected to the side of a device that is a cooling target, wherein the evaporation section is disposed on one surface of the mounting plate and the condensation section is disposed on the other side of the mounting plate.
 2. The cooling device of claim 1, wherein at least a part of the evaporation section and the liquid pipe is disposed in a space that is formed at a part in the mounting plate in the plate thickness direction.
 3. The cooling device of claim 1 wherein the condensation section includes an opening in a bottom face thereof, the mounting plate includes a first opening in an top face thereof, and the liquid pipe is formed so that the opening in the bottom face of the condensation section comes in contact with the first opening in the top face of the mounting plate.
 4. The cooling device of claim 1, wherein the mounting plate is formed so that a plurality of flat plate members are laminated.
 5. The cooling device of claim 4, wherein the mounting plate comprising; an top plate for forming an top face of the evaporation section, a connection section of the vapor pipe and a connection section of the liquid pipe: a middle plate for forming a side face of the evaporation section and the liquid pipe: and a bottom plate for forming a bottom face of the evaporation section.
 6. The cooling device of claim 1 wherein a fin-shaped projection is formed on the bottom face of the evaporation section that comes in contact with the liquid refrigerant.
 7. The cooling device of claim 1 wherein a sintered body is joined to the bottom of the evaporation section that comes in contact with the liquid-phase refrigerant.
 8. The cooling device of claim 7, wherein the sintered body is made of a metal that is the same as that of the bottom plate.
 9. The cooling device of claim 5, wherein the bottom plate is made of a metal that is different from that of either one or both of the middle plate and the top plate.
 10. A method for manufacturing a cooling device, comprising: forming a mounting plate provided with a connection structure connected to the side of a device that is a cooling target by providing a connection structure on a flat surface member; disposing an evaporation section for storing a refrigerant on one surface of the mounting plate; disposing a condensation section for radiating heat by condensing and liquefying a gas-phase refrigerant that is gasified in the evaporation section on the other side of the mounting plate; and connecting the condensation section to the evaporation section by piping. 